Toshiba Corp. will build a new 300-millimeter wafer fabrication plant for power semiconductors that will more than double its production capacity by March 2025, the company announced Friday.
Construction of the new facility in Nomi, Ishikawa Prefecture, will take place in two phases, the company said. When the first phase is fully operational, Toshiba’s power semiconductor capacity will be 2.5 times larger than in fiscal 2021. Toshiba will invest about ¥100 billion ($870 million) to build the facility, the Nikkei newspaper reported earlier.
The move comes as makers of electronics and cars struggle to procure even basic chips for routine tasks such as power management and wireless connectivity. TDK Corp. warned last month that shortages of components are unlikely to abate for the rest of this year, while game console-makers Sony Group Corp. and Nintendo Co. this week said they expect semiconductor and shipping challenges to persist.
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